Hi Sun Technology Taps ABS Market to Fund Fintech Growth

Hi Sun Technology (China) Limited ( (HK:0818) ) has shared an update.

Hi Sun Technology’s subsidiary Ronghui Zhida Factoring has launched the Ronghui Zhida-Xingyue No. 2 Credit Supply Chain Financial Asset-backed Special Scheme in China, with regulatory clearance for up to RMB1 billion of non-revolving securities to be issued in tranches by July 2027. Phase 1, established on 12 March 2026, totals RMB150 million, split into a AAA-rated priority tranche of RMB142 million paying a 2.2% coupon and a subordinated tranche of RMB8 million, with the priority notes to be traded on the Shanghai Stock Exchange and sold to qualified institutional investors.

Proceeds from the asset-backed securities will primarily fund general working capital for the group’s fintech services business, aiming to diversify funding channels and secure lower-cost capital. The board expects the structure to strengthen the company’s financing profile and support operating activities and investments, while stressing that the issuance should not have any material adverse financial impact on the group or dilute shareholder interests.

The most recent analyst rating on (HK:0818) stock is a Hold with a HK$0.50 price target. To see the full list of analyst forecasts on Hi Sun Technology (China) Limited stock, see the HK:0818 Stock Forecast page.

More about Hi Sun Technology (China) Limited

Hi Sun Technology (China) Limited is a Bermuda-incorporated investment holding company whose subsidiaries focus on payment and digital services, fintech services, platform operation solutions and financial solutions. The group targets China’s financial and digital payments markets, using structured financing tools to support the working capital needs of its fintech segment.

Average Trading Volume: 1,461,894

Technical Sentiment Signal: Sell

Current Market Cap: HK$1.26B

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