Ensilica PLC (GB:ENSI) has released an update.
EnSilica PLC, a prominent ASIC chip maker, has inked a lucrative contract worth over $30 million with a European telecom equipment provider, set to bolster its revenues and solidify its position in the advanced semiconductor market. The deal, which spans a decade, includes the exclusive design and supply of ASICs crucial for next-gen telecom infrastructure, with production slated to start in 2027. The company’s expertise in high-performance radio frequency and digital systems was key in securing this partnership, highlighting EnSilica’s commitment to innovation in the telecommunications sector.
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