China Silver Tech Announces Major Bond Placement

China Silver Technology Holdings Limited (HK:0515) has released an update.

China Silver Technology Holdings Limited has announced a bond placement deal for up to HK$100,000,000 with independent placees, facilitated by China-Hong Kong Connect International Securities Limited after trading hours on 17 September 2024. The placement will occur over a period of six months or until the full subscription amount is met, with the placing agent receiving a 1% commission on the placed bonds.

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