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Chengdu Expressway Eyes RMB2 Billion Bond Issue
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Chengdu Expressway Eyes RMB2 Billion Bond Issue

Chengdu Expressway Co., Ltd. Class H (HK:1785) has released an update.

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Chengdu Expressway Co., Ltd. has announced plans to issue corporate bonds worth up to RMB2 billion to meet its financing needs and diversify its financial strategies. The bonds, with a term of up to 10 years and an expected coupon rate of 2.5% to 3.5%, are subject to regulatory approval and market conditions. Investors are cautioned to consider the potential risks involved as the issuance is not guaranteed.

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