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Besi Announces €350M Bond Offering Details

Besi Announces €350M Bond Offering Details

BE Semiconductor (GB:0XVE) has released an update.

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BE Semiconductor Industries N.V. (Besi) has announced the pricing of a €350 million bond offering with a 4.500% coupon, set to close on July 17, 2024. The proceeds are intended for general corporate purposes, including potential acquisitions. The offering, in the form of Senior Notes due 2031, targets qualified institutional buyers in the United States and non-U.S. persons in offshore transactions.

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