Hua Hong Semiconductor Calls EGM on Share-Financed Asset Acquisition and Fund-Raising Plan

Hua Hong Semiconductor Ltd. ( (HK:1347) ) just unveiled an announcement.

Hua Hong Semiconductor Limited has called an extraordinary general meeting for 10 February 2026 in hybrid format in Shanghai and online, where shareholders will vote on a series of ordinary resolutions related to the company’s plan to issue renminbi-denominated shares to acquire specified target assets and to raise supporting funds. The proposals include approving the issuance of RMB shares in lieu of a previously envisaged mix of cash and shares as consideration, detailed terms for the asset purchase and accompanying fund-raising, lock-up and impairment compensation arrangements, use of proceeds, and the required approvals from independent shareholders under Hong Kong listing and takeover rules, with the transaction mandate intended to remain valid for 12 months if passed; if endorsed, the package would facilitate a share-financed expansion of Hua Hong’s asset base while deepening its presence in China’s domestic capital markets and reshaping its capital structure through related party and connected transactions.

The most recent analyst rating on (HK:1347) stock is a Hold with a HK$109.00 price target. To see the full list of analyst forecasts on Hua Hong Semiconductor Ltd. stock, see the HK:1347 Stock Forecast page.

More about Hua Hong Semiconductor Ltd.

Hua Hong Semiconductor Limited is a Hong Kong–incorporated semiconductor manufacturer listed on the Hong Kong Stock Exchange, operating fabrication facilities in mainland China and focusing on foundry services for integrated circuits serving both domestic and international chip design customers.

Average Trading Volume: 36,117,021

Technical Sentiment Signal: Buy

Current Market Cap: HK$198.1B

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