Rapidus Raises ¥267.6 Billion to Fund 2nm Chip Ramp to Mass Production by 2027

New updates have been reported about Rapidus Corporation.

Rapidus Corporation has secured ¥267.6 billion (about $1.7 billion) in new funding from the Japanese government and 32 private-sector investors, establishing a capital base to move from R&D into volume manufacturing of 2nm logic semiconductors by 2027. The Information-Technology Promotion Agency (IPA), under Japan’s Ministry of Economy, Trade and Industry, committed ¥100 billion after Rapidus was selected in a competitive METI process as the entity most capable of ensuring stable domestic semiconductor production.

The remaining ¥167.6 billion came from a broad consortium that includes Canon, Development Bank of Japan, Fujitsu, NTT, SoftBank, Sony Group, major automakers, banks, and component manufacturers, bringing Rapidus’ stated capital plus legal capital surplus to ¥274.95 billion since its 2022 founding. This funding complements ongoing NEDO subsidies tied to Japan–U.S. collaborative projects on 2nm integration, advanced packaging, chiplet design, and short-turnaround manufacturing, positioning Rapidus as a strategic vehicle for Japan’s advanced-node revival and a potential future supplier to global system and cloud players.

Rapidus plans to continue layering capital increases and debt financing from both public and private channels to bridge the heavy capex and process-development costs required to industrialize 2nm technology. For executives and investors, the round signals strong state-backed confidence in Rapidus’ ability to close the gap with incumbent foundries, while also locking in a diversified strategic shareholder base across IT, automotive, telecom, and financial sectors.

Execution risk remains high given the technological leap, schedule to 2027 mass production, and the need to attract leading-edge foundry customers in a competitive global market. However, if Rapidus achieves its roadmap, it could become a critical domestic node in Japan’s semiconductor supply chain resilience strategy and a meaningful new advanced-logic capacity source for multinational OEMs and hyperscalers seeking geographic and vendor diversification.